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Reduction of residual stress in AlN thin Films synthesized by magnetron sputtering technique

机译:减少磁控管合成的alN薄膜中的残余应力   溅射技术

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摘要

We report the reduction in residual stress of AlN thin films and also thecrystal structure, surface morphology and nanomechanical properties ofmagnetron sputtered as a function of substrate temperature (Ts, 35 - 600 ?C).The residual stress of these films was calculated by sin2 technique and foundthat they are varying from tensile to compression with temperature (Ts).Evolution of crystalline growth of AlN films was studied by GIXRD andtransmission electron microscopy (TEM) and a preferred a-axis orientation wasobserved at 400 ?C. The cross-sectional TEM micrograph and selected areaelectron difraction (SAED) of this film exhibited a high degree of orientationas well as a columnar structure. Hardness (H) measured by Nanoindentationtechnique on these films ranged between 12.8 - 19 GPa.
机译:我们报道了AlN薄膜残余应力的降低,以及溅射的磁控管的晶体结构,表面形态和纳米力学性能与衬底温度(Ts,35-600°C)的关系。这些薄膜的残余应力通过sin2技术计算通过GIXRD和透射电子显微镜(TEM)研究了AlN薄膜的晶体生长演化,并在400°C时观察到了较好的a轴取向。该膜的横截面TEM显微照片和选择区域电子衍射(SAED)显示出高取向度以及柱状结构。通过纳米压痕技术测量的这些膜的硬度(H)为12.8-19 GPa。

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